Inkbit joins Synera’s Ecosystem

We are thrilled to announce Synera and Inkbit have partnered to integrate Inkbit's Scalable Spectral Packing (SSP) technology into Synera's automation platform for engineers. This collaboration was initiated through one of Synera's existing customers who achieved significant reduction in manual build preparation time using Synera's customizable automation capabilities. Inkbit's industry-leading 3D nesting algorithm will further enhance manufacturing efficiency for companies seeking to automate their SLS build preparation workflows.

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Born out of collaboration between Inkbit and MIT
Inkbit's Scalable Spectral Packing (SSP) software delivers automated part arrangement for manufacturing processes with 25-30% higher packing density than existing solutions. The technology uses spectral domain computations to arrange parts up to 6 times faster than current tools, while automatically preventing part interlocks. Proven to handle over 6,000 parts in a single build, SSP optimizes space utilization across 3D printing, robotics, and logistics applications, directly improving equipment throughput and reducing production costs.

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Build Prep Automation in Synera
Synera's automation platform enables engineers to create and share automated additive manufacturing workflows without coding. The platform integrates with existing AM software tools across the design and manufacturing spectrum and provides direct access to solutions through its marketplace. Teams have been able standardize their build preparation processes by creating reusable, visually documented workflows that capture their engineering knowledge.

Real-world Impact:

• Stop wasting time on repetitive manual build prep tasks  

• No more fighting with scripts or dealing with code maintenance  

• Eliminate bottlenecks in accessing new software tools  

• Reduce errors from inconsistent processes across teams‍ and bring your quality to a new level

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Driving Industrial Adoption of AM together
Both companies see this partnership as a direct response to additive manufacturing engineers' needs for more efficient, automated solutions. The integration of SSP into Synera's platform represents a step forward in maturing automation possibilities for additive manufacturing to make AM cost effective for more companies.

"We have customers are already transforming their AM operations with Synera, cutting manual build prep time substantially. Adding Inkbit's revolutionary packing technology is the natural next step in helping them maximize their equipment utilization while maintaining these efficiency gains. This customer-driven partnership is exactly the kind of industry collaboration that makes manufacturing automation more effective." - Andrew Sartorelli, Partner & Product Management Lead at Synera

This focus on practical automation and customer needs aligns perfectly with Inkbit's vision for their technology. Their SSP solution is already proving its value in production environments:

"When we developed SSP, we focused on creating the most efficient and highest performance 3D packing technology possible. Partnering with Synera allows us to deliver this capability exactly where engineers need it - directly in their automated build prep workflows. This is about making advanced technology accessible and practical for everyday manufacturing." - Javier Ramos, Chief Technology Officer at Inkbit  

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‍Getting Started with SSP on Synera
Engineers interested in utilizing Inkbit's SSP technology through the Synera platform can expect availability in early Q2 2025. For more information about implementing automated build prep workflows utilizing Inkbit’s SSP in Synera, visit https://www.synera.io or contact product@synera.io.

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About Inkbit3D

Inkbit is an additive manufacturing company located in Medford, Massachusetts. The Inkbit Vista™ system is designed for mass production of end-use polymer 3D printed parts. They have incorporated a novel technology called Vision-Controlled Jetting (VCJ) that delivers high-resolution print capability enabling users to print parts with dimensional accuracy and precision at high volume.
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